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Articles (190)
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Feature extraction for rolling element bearing fault diagnosis utilizing generalized S transform and two-dimensional non-negative matrix factorization

Bing Li, Pei-lin Zhang, Dong-sheng Liu, Shuang-shan Mi, Guo-quan Ren, Hao Tian

Journal:

Journal of Sound and Vibration

Année:

2011

Langue:

english

Fichier:

PDF, 2.02 MB

english, 2011

The physiological responses of carnation cut flowers to exogenous nitric oxide

Chang-li Zeng, Li Liu, Guo-quan Xu

Journal:

Scientia Horticulturae

Année:

2011

Langue:

english

Fichier:

PDF, 308 KB

english, 2011

Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Mei, Yun-Hui, Lian, Jiao-Yuan, Chen, Xu, Chen, Gang, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 1.68 MB

english, 2014

Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Microelectronics Reliability

Année:

2015

Langue:

english

Fichier:

PDF, 3.63 MB

english, 2015

Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging

Fu, Shancan, Mei, Yunhui, Li, Xin, Ning, Puqi, Lu, Guo-Quan

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 2.42 MB

english, 2015

Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)

Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Journal of Electronic Materials

Année:

2016

Langue:

english

Fichier:

PDF, 3.21 MB

english, 2016

[IEEE 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa, FL, USA (2017.3.26-2017.3.30)] 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - A phase-leg IGBT module using DBC substrate without Ag finish by pressureless sintering of nanosilver paste

Yan, Haidong, Mei, Yunhui, Li, Xin, Chen, Gang, Lu, Guo-Quan

Année:

2017

Langue:

english

Fichier:

PDF, 3.81 MB

english, 2017

A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Li, Jie, Li, Xin, Wang, Lei, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Materials & Design

Année:

2018

Langue:

english

Fichier:

PDF, 1.82 MB

english, 2018

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Bonding of large substrates by silver sintering and characterization of the interface thermal resistance

Gao, Shan, Yang, Zhenwen, Tan, Yansong, Li, Xin, Chen, Xu, Sun, Zhan, Lu, Guo-Quan

Année:

2017

Langue:

english

Fichier:

PDF, 450 KB

english, 2017

Short-Term Wind Power Prediction Based on Improved Chicken Algorithm Optimization Support Vector Machine

Fu, Chao, Li, Guo-Quan, Lin, Kuo-Ping, Zhang, Hui-Juan

Journal:

Sustainability

Année:

2019

Langue:

english

Fichier:

PDF, 1.46 MB

english, 2019

Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

Wang, Meiyu, Mei, Yunhui, Liu, Wen, Xie, Yijing, Fu, Shancan, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Année:

2019

Langue:

english

Fichier:

PDF, 7.20 MB

english, 2019

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan, Yansong, Li, Xin, Chen, Xu, Yang, Zhenwen, Lu, Guo-Quan

Journal:

Soldering & Surface Mount Technology

Année:

2019

Fichier:

PDF, 2.01 MB

2019

Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste

Xu Chen, Rong Li, Kun Qi, Guo-Quan Lu

Journal:

Journal of Electronic Materials

Année:

2008

Langue:

english

Fichier:

PDF, 348 KB

english, 2008

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Chen, Gang, Zhang, Ze-Sheng, Mei, Yun-Hui, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

Microelectronics Reliability

Année:

2013

Langue:

english

Fichier:

PDF, 1009 KB

english, 2013

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force

Li, Xin, Chen, Gang, Chen, Xu, Lu, Guo-Quan, Wang, Lei, Mei, Yun-Hui

Journal:

Microelectronics Reliability

Année:

2013

Langue:

english

Fichier:

PDF, 1.64 MB

english, 2013

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

Mei, Yunhui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2013

Langue:

english

Fichier:

PDF, 940 KB

english, 2013

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

Fu, Shancan, Mei, Yunhui, Lu, Guo-Quan, Li, Xin, Chen, Gang, Chen, Xu

Journal:

Materials Letters

Année:

2014

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2014

Microstructures and properties of Al–45%Si alloy prepared by liquid–solid separation process and spray deposition

LI, Yan-xia, LIU, Jun-you, WANG, Wen-shao, LIU, Guo-quan

Journal:

Transactions of Nonferrous Metals Society of China

Année:

2013

Langue:

english

Fichier:

PDF, 5.81 MB

english, 2013

Mechanism of Migration of Sintered Nanosilver at High Temperatures in Dry Air for Electronic Packaging

Lu, Guo-Quan, Yang, Wen, Mei, Yun-Hui, Li, Xin, Chen, Gang, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2014

Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging

Mei, Yun-Hui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2014

Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement

Jiang, Li, Lei, Thomas Guangyin, Ngo, Khai D. T., Lu, Guo-Quan, Luo, Shufang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2014

Langue:

english

Fichier:

PDF, 5.99 MB

english, 2014

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging

Fu, Shancan, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

Année:

2014

Langue:

english

Fichier:

PDF, 953 KB

english, 2014

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Li, Xin, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Année:

2010

Langue:

english

Fichier:

PDF, 678 KB

english, 2010

Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions

Yan, Haidong, Mei, Yunhui, Li, Xin, Zhang, Pu, Lu, Guo-Quan

Journal:

Microelectronics Reliability

Année:

2015

Langue:

english

Fichier:

PDF, 2.55 MB

english, 2015

Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

Fu, Shancan, Mei, Yunhui, Li, Xin, Ma, Changsheng, Lu, Guo-Quan

Journal:

IEEE Transactions on Power Electronics

Année:

2016

Langue:

english

Fichier:

PDF, 3.34 MB

english, 2016

A Multichip Phase-Leg IGBT Module Bonded by Pressureless Sintering of Nanosilver Paste

Fu, Shancan, Mei, Yunhui, Li, Xin, Ma, Changsheng, Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2017

Langue:

english

Fichier:

PDF, 2.06 MB

english, 2017

The Mechanism of Antifungal Action of a New Polyene Macrolide Antibiotic Antifungalmycin 702 from Streptomyces padanus JAU4234 on the Rice Sheath Blight Pathogen Rhizoctonia solani

Xiong, Zhi-Qiang, Tu, Xiao-Rong, Wei, Sai-Jin, Huang, Lin, Li, Xun-Hang, Lu, Hui, Tu, Guo-Quan, Virolle, Marie-Joelle

Journal:

PLoS ONE

Année:

2013

Langue:

english

Fichier:

PDF, 924 KB

english, 2013

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - A high power density multichip phase-leg IGBT module with void-free die attachment using nanosilver paste

Fu, Shancan, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

Année:

2017

Langue:

english

Fichier:

PDF, 542 KB

english, 2017

Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm 2 ) power chips for electronics packaging

Xie, Yijing, Wang, Yanjie, Mei, Yunhui, Xie, Haining, Zhang, Kun, Feng, Shuangtao, S Siow, Kim, Li, Xin, Lu, Guo-Quan

Journal:

Journal of Materials Processing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 899 KB

english, 2018

Low-Pressure-Assisted Large-Area (>800 mm 2 ) Sintered-Silver Bonding for High-Power Electronic Packaging

Tan, Yan-Song, Li, Xin, Chen, Xu, Lu, Guo-Quan, Mei, Yun-Hui

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 2.78 MB

english, 2018

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Design of a novel, high-density, high-speed 10 kV SiC MOSFET module

DiMarino, Christina, Johnson, Mark, Mouawad, Bassem, Li, Jianfeng, Boroyevich, Dushan, Burgos, Rolando, Lu, Guo-Quan, Wang, Meiyu

Année:

2017

Langue:

english

Fichier:

PDF, 1.62 MB

english, 2017

CCharacterizations of A Proposed 3300-V Press- Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications

Feng, Jingjing, Mei, Yunhui, Li, Xianbin, Lu, Guo-Quan

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Année:

2018

Langue:

english

Fichier:

PDF, 3.59 MB

english, 2018

Tracking pollutants in dietary fish oil: From ocean to table

Sun, Sheng-Xiang, Hua, Xue-Ming, Deng, Yun-Yun, Zhang, Yun-Ni, Li, Jia-Min, Wu, Zhao, Limbu, Samwel Mchele, Lu, Da-Sheng, Yin, Hao-Wen, Wang, Guo-Quan, Waagbø, Rune, Livar, Frøyland, Zhang, Mei-Ling,

Journal:

Environmental Pollution

Année:

2018

Langue:

english

Fichier:

PDF, 3.91 MB

english, 2018

A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere

Yan, Haidong, Mei, Yun-Hui, Li, Xin, Ma, Changsheng, Lu, Guo-Quan

Journal:

IEEE Transactions on Electron Devices

Année:

2018

Langue:

english

Fichier:

PDF, 1.87 MB

english, 2018

Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

Wang, Xiaomin, Mei, Yunhui, Li, Xin, Wang, Meiyu, Cui, Zhenduo, Lu, Guo-Quan

Journal:

Journal of Alloys and Compounds

Année:

2018

Langue:

english

Fichier:

PDF, 7.22 MB

english, 2018

Pressureless Silver Sintering on Nickel for Power Module Packaging

Wang, Meiyu, Mei, Yunhui, Li, Xin, Burgos, Rolando, Boroyevich, Dushan, Lu, Guo-Quan

Journal:

IEEE Transactions on Power Electronics

Année:

2019

Fichier:

PDF, 5 KB

2019

Bio-detoxification Bacteria Isolated from Dye-Polluted Soils Promote Lactic Acid Production from Ammonia Pretreated Corn Stover

Liu, Ling, Cai, Yuyuan, Li, Hong, Zhao, Shumiao, He, Mingxiong, Hu, Guo-quan, Liang, Yunxiang, Peng, Nan, Hu, Jinglong

Journal:

Applied Biochemistry and Biotechnology

Année:

2019

Langue:

english

Fichier:

PDF, 1.31 MB

english, 2019

An explanation of sintered silver bonding formation on bare copper substrate in air

Du, Cheng-Jie, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Applied Surface Science

Année:

2019

Langue:

english

Fichier:

PDF, 4.31 MB

english, 2019

Die-attach on Nickel Substrate by Pressureless Sintering A Trimodal Silver Paste

Wang, Meiyu, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

Journal:

Materials Letters

Année:

2019

Langue:

english

Fichier:

PDF, 2.11 MB

english, 2019

Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures

Du, Cheng-Jie, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2019

Langue:

english

Fichier:

PDF, 1.96 MB

english, 2019

[IEEE 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Shanghai, China (2019.5.19-2019.5.23)] 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Die-attach on Copper by Pressureless Silver Sintering in Formic Acid

Wang, Meiyu, Xie, Yijing, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

Année:

2019

Langue:

english

Fichier:

PDF, 4.38 MB

english, 2019

Synthesis, electrical and ultrafast nonlinear optical properties of Sn–ZnO composite film

Li, Si-Qiu, Yao, Cheng-Bao, Han, Yue, Jiang, Guo-Quan, Cai, Yu, Yin, Hai-Tao, Sun, Wen-Jun

Journal:

Optical Materials

Année:

2019

Langue:

english

Fichier:

PDF, 3.68 MB

english, 2019

Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint

Tan, Yansong, Li, Xin, Chen, Gang, Gao, Qitong, Lu, Guo-Quan, Chen, Xu

Journal:

International Journal of Adhesion and Adhesives

Année:

2019

Langue:

english

Fichier:

PDF, 4.78 MB

english, 2019

Biochar-mediated enhanced ethanol fermentation (BMEEF) in Zymomonas mobilis under furfural and acetic acid stress

Wang, Wei-ting, Dai, Li-chun, Wu, Bo, Qi, Bu-fan, Huang, Tian-fang, Hu, Guo-quan, He, Ming-xiong

Journal:

Biotechnology for Biofuels

Année:

2020

Fichier:

PDF, 1.76 MB

2020

Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature

Li, Dan, Mei, Yunhui, Xin, Yunchang, Li, Zhi-Qiao, Chu, Paul K., Ma, Changsheng, Lu, Guo-Quan

Journal:

IEEE Transactions on Power Electronics

Année:

2020

Fichier:

PDF, 820 KB

2020

Efficient layout design automation for multi-chip SiC modules targeting small footprint and low parasitic

Mei, Yunhui, Hao, Baisen, Chen, Yue, Wang, Meiyu, Li, Xin, Lu, Guo-Quan

Journal:

IET Power Electronics

Année:

2020

Fichier:

PDF, 2.02 MB

2020

Argusides B and C, Two New Cytotoxic Triterpene Glycosides from the Sea Cucumber Bohadschia argusJaeger

Bao-Shu Liu, Yang-Hua Yi, Ling Li, Peng Sun, Wei-Hua Yuan, Guo-Quan Sun, Hua Han, Mei Xue

Journal:

Chemistry & Biodiversity

Année:

2008

Langue:

english

Fichier:

PDF, 184 KB

english, 2008

Argusides D and E, Two New Cytotoxic Triterpene Glycosides from the Sea Cucumber Bohadschia argusJaeger

Bao-Shu Liu, Yang-Hua Yi, Ling Li, Peng Sun, Hua Han, Guo-Quan Sun, Xiao-Hua Wang, Zeng-Lei Wang

Journal:

Chemistry & Biodiversity

Année:

2008

Langue:

english

Fichier:

PDF, 180 KB

english, 2008

Two New Cytotoxic Nonsulfated Pentasaccharide Holostane (=20-Hydroxylanostan-18-oic Acid γ-Lactone) Glycosides from the Sea Cucumber Holothuria grisea

Guo-Quan Sun, Ling Li, Yang-Hua Yi, Wei-Hua Yuan, Bao-Shu Liu, Yi-Yi Weng, Shi-Long Zhang, Peng Sun, Zeng-Lei Wang

Journal:

Helvetica Chimica Acta

Année:

2008

Langue:

english

Fichier:

PDF, 190 KB

english, 2008

A new feature extraction and selection scheme for hybrid fault diagnosis of gearbox

Bing Li, Pei-lin Zhang, Hao Tian, Shuang-shan Mi, Dong-sheng Liu, Guo-quan Ren

Journal:

Expert Systems with Applications

Année:

2011

Langue:

english

Fichier:

PDF, 928 KB

english, 2011